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Battery Management System/tec/pcb Test Equipment
Product Details:
| Place of Origin: | Guangdong |
| Brand Name: | Xing Da |
| Model Number: | PCB Assembly |
| FOB Price: | Get Latest Price |
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| PCB Assembly: | PCB Assembly |
| Base Material: | HASL / HASL lead free, Chemical tin, Chemical Gold,OSP |
| Surface Finishing: | HASL / HASL lead free, Chemical tin, Chemical Gold,OSP |
| Board Thickness: | 0.2mm-6mm(8mil-126mil) |
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.075mm(3mil) |
| Copper Thickness: | 1/2 oz min; 12 oz max |
| Min. Hole Size: | 0.1mm(4mil) |
| Category: | Multilayer PCB |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 Piece/Pieces |
|---|---|
| Packaging Details: | Vacuum package with carton |
| Delivery Time: | PCB5-8 workdays |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 50000 Square Meter/Square Meters per Month |
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Detail Information |
Product Description
Battery Management System/tec/pcb Test Equipment
1.Adopt OEM &ODM
2.No MOQ
3.ISO9001/TS16949/IPC/ROHS/UL
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Shenz Tea Set PCBA hen Xindaxing Electric Technology Co., Ltd.
(Xing Da Electric Technology Co.,Ltd),which has been specializing in PCB/PCBA- and Electronic components for many years
We can prvide a package of service:
-1.High quality--PCB board- Maker ,PCB manufacturer ,PCB factory, we can provide our clients with ravious kinds of-high quality-PCB and defferent kinds of service ,from pcb layout to assembly all parts
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Supply--Battery Management System/tec/pcb Test Equipment
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2.Adopt OE M & ODM
3.Enjoy popularity in Asia & Europe
4.ISO14001:2004 PCBA Mobile DVD PCBA& ISO9001:2000
5.ROHs printed board
6.High quality printed circuit boards with the best price
7.The best service for printed wire board
8.Pcb manufacturer, pcb factory, pcb maker,
pcb supplier, pcb seller, pcb exporter
9.Be able to handle high difficult pcb and pcba
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Our advantaged products and service:
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PCB Layout,PCBA Factory,HDI PCB,Printed circuit board,
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BGA PCB,Printed circuit board,Heavy copper PCB,Heavy Au PCB,
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Heavy Gold PCB,Ceramic PCB,Pottery PCB.Crockery PCB.FPC,FPCA,
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Flexible PCB/Printed circuit boards,Flexible PCB assembly. Carbon Oil PCB,
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Carbon Printed circuit boards.High TG PCB,All Electronic Components,
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PCB Assembly,Write programs,PCBA test
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Detailed terms for PCB Assembly
Technical requirement
1)Professional surface-mounting and Through-hole soldering technology
2)Various sizes like 1206,0805,0603 components SMT technology
3)ICT (In Circuit Test),FCT (Functional Circuit Test ) technology
4)PCB Assembly with VL.CE.FCC.Rohs Approval
5)Nitrogen gas reflow soldering technology for SMT
6)High standard SMT&Solder Assembly Line
7)High density interconnected board place ment technology capacity
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Many agile forms of cooperation(OEM ,ODM) are welcome!
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Give us the detailed files(Gerber files and specification )or samples,
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We will be very happy to quote for you.
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Our first-class technology, best service and reasonable price will attract you!
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If you have any query,don't hesitate to contact us!We'd like to help you!
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Welcome to visit our factory!
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-1.Specification for PCB Manufacture:
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Item |
Specification |
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Numbr of Layer |
1-38Layers |
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Material |
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic-, crockery |
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Metal-backed Laminate |
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Remarks |
High Tg CCL Is Availabe(Tg>=170ºC) |
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Finish Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
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Minimun Core Thickness |
0.075mm(3mil) |
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Copper Thickness |
1/2 oz min;12 oz max |
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Min.Trace Width & Line Spacing |
0.075mm/0.1mm(3mil/4mil) |
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Min.Hole Diameter for CNC Driling |
0.1mm(4mil) |
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Min.Hole Diameter for punching |
0.9mm(35mil) |
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Biggest panel size |
610mm*508mm |
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Hole Positon |
+/-0.075mm(3mil) CNC Driling |
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Conductor Width(W) |
+/-0.05mm(2mil)or |
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+/-20% of original artwork |
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Hole Diameter(H) |
PTH L:+/-0.075mm(3mil) |
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Non-PTH L:+/-0.05mm(2mil) |
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Outline Tolerance |
+/-0.125mm(5mil) CNC Routing |
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+/-0.15mm(6mil) by Punching |
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Warp & Twist |
0.70% |
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Insulation Resistance |
10Kohm-20Mohm |
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Conductivity |
<50ohm |
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Test Voltage |
10-300V |
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Panel Size |
110×100mm(min) |
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660×600mm(max) |
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Layer-layer misregistration |
4 layers:0.15mm(6mil)max |
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6 layers:0.25mm(10mil)max |
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Min.spacing between hole edge to circuity pqttern of an inner layer |
0.25mm(10mil) |
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Min.spacing between board oulineto circuitry pattern of an inner layer |
0.25mm(10mil) |
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Board thickness tolerance |
4 layers:+/-0.13mm(5mil) |
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6 layers:+/-0.15mm(6mil) |
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Impedance Control |
+/-10% |
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Different Impendance |
+-/10% |
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