• Fully Enclosed Laser Drilling Machine For Printed Circuit Board / HDI Board ≤10μm
  • Fully Enclosed Laser Drilling Machine For Printed Circuit Board / HDI Board ≤10μm
Fully Enclosed Laser Drilling Machine For Printed Circuit Board / HDI Board ≤10μm

Fully Enclosed Laser Drilling Machine For Printed Circuit Board / HDI Board ≤10μm

Product Details:

Place of Origin: China
Brand Name: Asida
Certification: CE
Model Number: JG23

Payment & Shipping Terms:

Minimum Order Quantity: 1 Set / Sets
Price: Negotiation
Packaging Details: Wooden Carton
Delivery Time: Negotiation
Payment Terms: T/T
Supply Ability: Negotiation
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Detail Information

Product Name: UV Laser Drilling Machine System Processing Accuracy: ±25um
Differences Between Up And Down Hole Diameter: ≤10μm Minimum Processing Hole Diameter: 25μm
High Light:

laser drilling equipment

,

pcb drilling machine

Product Description

UV laser drilling for the printed circuit board FPC /CVL / RF

 

Product Attributes:

 

Product name :

UV Laser Drilling Machine 

Brand Name:

ASIDA

Model Number:

JG21

Place of Origin:

China

Packaging Details:

Wooden Carton

 

USAGE

 

Drilling blind holes, vias in HDI board, blind cut and blind slot in flexible board with low carbonisation . 

 

CHARACTERISTICS 

1. Safe and reliable: fully enclosed design, automatic control of worktable door to ensure safe operation.2. Automation: Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design . 

3. Energy measuring: Automatically measure energy on the samples .  

4. High drilling / cutting precision: Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality .  

5. Multi-panels cutting: With function to cutting array panels . 

6. Optical optimization: High peak power and high pulse energy, fine focal spot, ensure cutting and drilling with high speed and high precision .  

7. Convenient operation: Drilling and cutting with independent module, easy conversion. 

8. Optimize design: Optimization of laser processing path function, reduce processing time and improve efficiency .

 

UV Laser Drilling Machine Client:

 

System processing accuracy

±25um(ZHENGYE conditions)

Drilling speed

>250 holes for every second

Roundness

≥95%

Differences between up and down hole diameter

≤10μm

Objects

① Maximum processing size:560X650mm

② Minimum processing hole diameter:25μm

Dimensions

1610*1660*1550mm

Weight

2900Kg

 

The Undertaking services:

 

The warranty of our company's equipment is 12 months. During the warranty period, we will be responsible for the repair of re-placement the damaged or broken-down equipment free, except that the malfunction is caused by the customer' fault .

 

We will respond to the technical problem putted forward by the customer within one hour. If the equipment breks dowm ,our cpmpany guarantee that we will send maintenance staff to solve the problem wihtin 48 hours. As for the customers in remote areas, we will negotiate with customers about the time .

 

We have established nationwide network of maintenance services of equipments. We will track the equipmtent during its life cycle, and appoint officers to visit the customers regularly ( call customer quarterly ), so sa to discover the potential failure and resovle it.Taking precautionary measures makes equipment in good working condition .

 

Drilling Samples :

Fully Enclosed Laser Drilling Machine For Printed Circuit Board / HDI Board ≤10μm 0

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