• Silicon And Uncovery Laser Cutting Machines 8W / 30KHz Intelligent Ceramic
  • Silicon And Uncovery Laser Cutting Machines 8W / 30KHz Intelligent Ceramic
Silicon And Uncovery Laser Cutting Machines 8W / 30KHz Intelligent Ceramic

Silicon And Uncovery Laser Cutting Machines 8W / 30KHz Intelligent Ceramic

Product Details:

Place of Origin: China
Brand Name: Asida
Certification: CE
Model Number: JG16

Payment & Shipping Terms:

Minimum Order Quantity: Negotaition
Price: Negotaition
Packaging Details: Wooden Carton
Delivery Time: Negotaition
Payment Terms: T/T
Supply Ability: Negotaition
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Detail Information

Laser Power: 8W/30KHz Laser Frequency: 30-120KHz
Cutting Thickness: ≦1.0mm Maximum Processing Size: 500X400mm
High Light:

laser cutting machinery

,

small laser cutting machine

Product Description

Ceramic / Silicon and Uncovery for CVL / FPC / RF Laser Cutting Machine

 

Product Attributes:

 

Product name:

UV Laser Cutting Machine 

Brand Name:

ASIDA

Model Number:

JG16

Certification:

CE

Place of Origin:

China

Packaging Details:

Wooden Carton

 

 

UV Laser Cutting Machine USAGE

Coverlay /FPC/RF and thin multilayer board cutting.

 

Laser Cutting Machine CHARACTERISTICS

1. Safe and reliable. Fully enclosed design, automatic control of worktable door to ensure safe 

operation;

2. Automation. Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design; 

3.High drilling / cutting precision. Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality;  

4. Multi-panels cutting. With function to cut array panels; 

5. Double working table which can save time of feeding and blanking material and thus improve working efficiency.

 

Laser Cutting Machine Technical parameters

 

 ITEM

 SPECIFICATION

MODEL

JG16

Laser Source

                                    All-solid-state UV laser device, wavelength 355nm

Laser Power

8W/30KHz

Laser Frequency

30-120KHz

Maximum Processing Size

500x400mm(Double working table)

 Platform Maximum Operating Speed

24m/min

 Platform Maximum Positioning Accuracy

±5µm

Platform Maximum Repeat Positioning Accuracy

±2µm

 System Processing Precision

±25µm

Cutting Line Width

20±5µm

Cutting Thickness

<1.0mm

File format

Gerber & .DXF & .lay,Standard G code

(Can switch via CAM)

Power

AC220V 50Hz/2.5KW,AC380V 50Hz/5.5KW

 Vacuuming Requirements

516m³/h

 Overall Dimensions

1780x1680x1560mm

 Weight

2500Kg

Environmental Temperature

20±2℃

 Environmental Humidity

<60%RH No dew

 

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