• Ultraviolet laser drilling technology for Printed Circuit Board
  • Ultraviolet laser drilling technology for Printed Circuit Board
  • Ultraviolet laser drilling technology for Printed Circuit Board
Ultraviolet laser drilling technology for Printed Circuit Board

Ultraviolet laser drilling technology for Printed Circuit Board

Product Details:

Place of Origin: China
Brand Name: ASIDA
Certification: CE
Model Number: JG21

Payment & Shipping Terms:

Minimum Order Quantity: 1Set
Price: Negotiation
Packaging Details: Wooden Carton
Delivery Time: 4 Weeks
Payment Terms: T/T, L/C
Supply Ability: 200sets/years
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Detail Information

Application: Laser Drilling Laser Type: UV
Cutting Thickness: 1mm Graphic Format Supported: DXF
CNC Or Not: Yes Control Software: Zhengye
High Light:

laser drilling equipment

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pcb drilling machine

Product Description

Ultraviolet laser drilling technology for Printed Circuit Board

 

 

1.Usage of UV Laser Drilling Machine(JG21)


The machine is used in drilling through -holes,blind hoes of FPC and cutting the CVL/FPC/RF.
2.Features of of UV Laser Drilling Machine(JG21) 
1. Adopting the technologies of  linear motor module,and high-resolution grating, closed loop servo control,optical positioning
Servo control,Sizing Compensate and Optical positioning technologies. 
2. High quality:With good roundness,clean hole wall,small differences between up and down hole diameter.
3. Highly intelligent,efficient:Auto focus,auto-correcting,auto-positioning,auto feeding and blanking with RTR. 
4.Customize:Optional RTR, and support maximum  500mm wide copper processing;customize a variety of hardware and software functions.

3.Drilling Samples of of UV Laser Drilling Machine(JG21) 
Ultraviolet laser drilling technology for Printed Circuit Board 0
 
4.Specifications of  UV Laser Drilling Machine(JG21) 
 

System processing accuracy

±25um(ZHENGYE conditions)

Drilling speed

180 holes for every second(ZHENGYE conditions)

Roundness

≥90%

Differences between up and down hole diameter

≤12.5μm

Objects

Maximum processing size:560X650mm

Minimum processing hole diameter:50μm

Dimensions

1610x1660x1550mm

Weight

2900Kg

 

Ultraviolet laser drilling technology for Printed Circuit Board 1 

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